PART |
Description |
Maker |
GAPM3020P |
Mini size of Discrete semiconductor elements
|
Anpec Electronics Coropration
|
BCAXXXX |
Mini size of Discrete semiconductor elements
|
ETC
|
BFY280 BFY280H |
From old datasheet system HiRel NPN Silicon RF Transistor (HiRel Discrete and Microwave Semiconductor)
|
Infineon Siemens Semiconductor Group
|
BC847BS09 |
NPN GENERAL PURPOSE DUAL TRANSIS
|
Pan Jit International Inc.
|
BFY193 |
HIREL NPN SILICON RF TRANSISTOR (HIREL DISCRETE AND MICROWAVE SEMICONDUCTOR FOR LOW NOISE, HIGH GAIN BROADBAND AMPLIFIERS UP TO 2 GHZ.) From old datasheet system
|
Siemens Semiconductor Group Infineon
|
MS20 |
MIS/MOS Single Layer Capacitors Metal Insulator Semiconductor/Metal Oxide Semiconductor
|
AVX Corporation
|
KIA7812API KIA7805API KIA7807API KIA7806API KIA780 |
BIPOLAR LINEAR INTEGRATED CIRCUIT SEMICONDUCTOR SEMICONDUCTOR
|
KEC(Korea Electronics)
|
BXY42-T1 BXY42 BXY42-T BXY42-T1H |
HiRel Silicon PIN Diode (HiRel Discrete and Microwave Semiconductor PIN Diode for high speed switching of RF signals) Publications, Books From old datasheet system SILICON, PIN DIODE
|
Siemens Semiconductor G... SIEMENS AG SIEMENS[Siemens Semiconductor Group] SIEMENS A G
|
2SJ221 |
Box-shaped pin header, Discrete wire crimping connection, Discrete wire connectors; HRS No: 543-0611-3 05; No. of Positions: 8; Connector Type Silicon P-Channel MOS FET
|
Hitachi,Ltd. HITACHI[Hitachi Semiconductor]
|
HI1-774J5 HI3-674ALD5 HI3-674ATD/883 HI1-774AK5 HI |
Box-shaped pin header, Discrete wire crimping connection, Discrete wire connectors; HRS No: 536-0525-5 91; Contact Mating Area Plating: Gold Converter IC 转换IC Converter IC 转换器IC
|
Rochester Electronics, LLC Intersil, Corp.
|